| 流程 | 工站 | 檢查項目 |
|---|---|---|
| Process | work station | Inspection items |
| I P Q C | 鉆孔 Drilling |
孔粗/板厚/孔徑測量 Hole wall roughness/Thickness/Hole diameter |
| 外觀檢查 Appearance inspection |
||
| 沉銅 PTH |
背光檢測 Backlight test |
|
| 板電 Full plate electroplating |
孔/面銅 Hole/surface copper |
|
| 外觀檢查 Appearance inspection |
||
| 干膜 Dry film |
外觀檢查 Appearance inspection |
|
| 線寬/距測試 Trace width/spacing test |
||
| 圖電 Graphic plating |
孔/面銅厚度 Hole/surface copper thickness |
|
| AOI | ||
| 蝕刻 / AOI Etching/AOI |
熱應(yīng)力測試 Thermal stress test |
|
| 線寬/距檢查 Trace width/spacing inspection |
||
| I P Q C | 防焊 Solder Mask |
外觀檢查 Appearance inspection |
| 油墨厚度測量 Ink thickness |
||
| 拉力測試, 硬度測試 Tensile testing, hardness testing |
||
| IQC | 表面處理 Surface treatment |
外觀檢查 (表面處理檢測報告) Visual inspection (Finishing test report) |
| I P Q C | 成型 Routing |
外型尺寸檢查 Size check |
| 外觀檢查 Visual inspection |
||
| F Q C | F Q C | Visual Inspection |
| 板曲矯正 / 檢查 | ||
| Warpage check | ||
| F Q A | F Q A | 外觀檢查 Visual Inspection |
| 孔面 / 銅, 介質(zhì)層厚度測量 The hole/surface copper, dielectric measurements |
||
| 拉力測試 / 可焊性測試 / 熱應(yīng)力測試 Tensile testing / Solder ability Testing / Thermal stress test |
English